Infineon ESD202-B1-CSP01005E6327: Ultra-Miniature ESD Protection Diode for High-Density Circuit Design

In the relentless pursuit of miniaturization, modern electronics face a critical challenge: protecting increasingly sensitive integrated circuits (ICs) from electrostatic discharge (ESD) without compromising precious board space. The Infineon ESD202-B1-CSP01005E6327 emerges as a pivotal solution, specifically engineered to address this very dilemma in high-density applications.

This component is an ultra-miniature bidirectional ESD protection diode packaged in a chip-scale package (CSP) with the diminutive dimensions of 01005 (0.4 x 0.2 x 0.25 mm). This incredibly small footprint allows designers to place robust protection directly at the point of potential ESD strikes—such as USB ports, HDMI interfaces, antenna lines, or button contacts—without dictating the layout or increasing the overall size of the device. It is ideally suited for space-constrained applications including smartphones, wearables, IoT modules, and advanced medical implants.

The primary function of the ESD202-B1 is to clamp transient overvoltage events safely to ground, thereby shielding downstream ICs from damage. It offers robust protection, meeting the stringent IEC 61000-4-2 international standard (Level 4: ±8 kV contact discharge, ±15 kV air discharge). Despite its microscopic size, its low clamping voltage and ultra-low leakage current ensure that signal integrity remains uncompromised during normal operation, which is critical for high-speed data lines.

A key advantage of this diode is its bidirectional functionality, providing effective protection for both positive and negative transient voltage swings with a single component. This simplifies design and reduces the bill of materials (BOM). Furthermore, its minimal parasitic capacitance makes it an excellent choice for protecting high-speed data interfaces like USB 3.0, HDMI, and MIPI without degrading signal quality.

ICGOODFIND: The Infineon ESD202-B1-CSP01005E6327 is a testament to the innovation in passive component technology, offering maximal protection in a minimal footprint. It empowers engineers to build more reliable, durable, and compact electronic products without sacrificing performance for size, making it an indispensable component in the toolbox of modern circuit design.

Keywords:

1. ESD Protection

2. Miniature Footprint

3. Bidirectional Diode

4. High-Density Design

5. Chip-Scale Package (CSP)